Fullerene synthesis at industrial scale.

LiquidCarbon™ 

Carbon nanotube inks, formulations, and dispersions and Liquid Carbon semiconductor hardmasks.

Nano-C’s high-carbon content formulations can be used in a range of lithographic processes. With carbon content able to exceed 90%, these materials can be achieve carbon loading similar or exceeding CVD carbon processes. LiquidCarbon™ can be tuned along several key specifications in terms of concentration, solvents and chemical functionalization to optimize the most challenging lithography process demands.

Two examples of standard products classes are LC13 and LC18 which are a range of ultra-high carbon-content, high thermal stability, and high etch durability spin-on-carbon (SOC) hardmask formulations.

LiquidCarbon offers a solution processable ink formulation with the high carbon content of CVD Carbon

Explore LiquidCarbon™ Spin-On Carbon Hardmask

LC13 is a formulation to address low, medium and high temperature cures for an array of applications, in film thicknesses ranging from 10– 1500 nm.

Carbon nanotube inks, formulations, and dispersions and Liquid Carbon semiconductor hardmasks.

LC13

Features Include:
• Flexible carbon content (C: 80 – 97 wt%)
• Low aliphatic hydrogen levels
• Fab-compatible solvent systems
• High uniformity low defect coatings
• Etch durability > 90% of a-C (CVD carbon)
for LC13-HT with 500 °C bake in N2
• High thermal stability

LC18 is a formulations to address low, medium and high temperature cures for an array of applications, in film thicknesses ranging from 10 – 200 nm.

Liquid Carbon semiconductor hardmasks for advanced lithography.

LC18

Features Include:
• High Carbon Content (95 – 97 wt%)
• Low aliphatic hydrogen levels
• Fab-compatible solvent systems
• High uniformity low defect coatings
• Etch durability > 88% of a-C (CVD carbon) for
LC18HT with >500 °C bake in N2
• Low shrinkage on cure

Liquid Carbon fullerene-based hardmasks for industrial scale semiconductor manufacturing

Find the right LiquidCarbon™ formulation for your lithography process

Our team works directly with process and R&D engineers to match the right formulation to your specific cure temperature, film thickness, and solvent requirements.